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| Part Number | SMD291SNL60T4 |
| Datasheet | SMD291SNL60T4 datasheet |
| Description | SN96.5/AG3.0/CU0.5 2-PRT MIX 60G |
| Manufacturer | Chip Quik Inc. |
| Series | - |
| Part Status | Active |
| Type | Solder Paste, Two Part Mix |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter | - |
| Melting Point | 423 ~ 428°F (217 ~ 220°C) |
| Flux Type | No-Clean |
| Wire Gauge | - |
| Process | Lead Free |
| Form | Jar, 2.12 oz (60g) |
| Shelf Life | 24 Months |
| Shelf Life Start | Date of Manufacture |
| Storage/Refrigeration Temperature | 37°F ~ 77°F (3°C ~ 25°C) |